EPO-TEK® H20S – Epoxy conductive Adhesive

Unit : 1 oz

REF: D12672-20S Categories: ,

Description

Epo-Tek® H20S is a modified version of Epo-Tek®H20E.

Epo-Tek® H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency (mixing ratio 1:1). This modified version offers high electrical conductivity, short curing cycles, proven reliability, and the convenient mix ratio, Epo-Tek® H20S is extremely simple to use. Epo-Tek® H20S pot life is 2.5 days and shelf life is one year when store at room temperature.

Maximum Bond Line Cure Schedule:

175°C 45 seconds
150°C 5 minutes
120°C 15 minutes
100°C 45 minutes
80°C 90 minutes

Typical properties: (to be used as a guide only, not a specification)

Physical Properties

Color: Part A: silver; Part B: silver
Consistency: Smooth, thixotropic paste
Viscosity (@ 100 RPM / 23°C): 1.800-2.800 cPs
Thixotropic Index: 5
Glass Transition Temp (Tg): ≥80°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min)
Coefficient of Thermal Expansion (CTE): Below Tg: 31 x 10-6 in/in/°C
Above Tg: 120 x 10-6 in/in/°C
Shore D hardness: 57
Lap Shear Strength @ 23°C: 1,240 psi
Die Shear Strength @ 23°C: >5 kg / 1,700 psi
Degradation Temp (TGA): 414°C
Weight Loss: @ 200°C: 0.40%
@ 300°C: 1.37%
@ 250°C: 0.60%
Operating Temp: Continuous: -55°C to 200°C
Intermittent: -55°C to 300°C
Storage Modulus @ 23°C: 339, 720 psi
Ion: Cl- 162 ppm
Na+ 0 ppm
NH4+ 282ppm
K+ 4 ppm
Particle Size: ≤20 microns

Electrical Properties:

Volume Resistivity @ 23°C: ≤0.0005 Ohm-cm

 

Thermal Properties:

Thermal Conductivity: 3.25 W/mK

 

Storage : RT

TDS_Epo-Tek_H20S_Adhesive

MSDS_12672-A

MSDS_12672-B

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