Available in sheet form 10″x10″ (254x254mm). To use, remove the paper backing exposing the adhesive layer. The substrate is positioned on the film and pressed down firmly so that it adheres to the plastic film. No heating is required. The wafer mounted on the plastic film can then be held down using a vacuum manifold or mechanical means for dicing or scribing. After dicing or scribing, the parts can be separated from the wafer-mount 559 film by washing in acetone or MEK. Ideal for holding down silicon wafers, alumina, or glass substrates for scribing.
Sheet 10″ x 10″ (254 x 254 mm). Press down firmly to adhere substrate to film. No heating is required. Ideal for holding down silicon wafers, alumina, or glass substrates for scribing. Dissolves in acetone or MEK.
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