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DESCRIPTION Silicon Nitride (SiN) Half-Grids For Lift-Out Applications 100 micron thick frame, fits… Show more (+) DESCRIPTION Silicon Nitride (SiN) Half-Grids For Lift-Out Applications 100 micron thick frame, fits flip-stage SEM/FIB and standard TEM sample holders – 400 nm thick low-stress Silicon Nitride film – (1) 100 x 500 micron window with the free-edge along length What’s NEW? Our Silicon Nitride Lift-Out TEM Windows feature a large, robust window […] Show less (-) |
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Chip frame: 2.9 mm diameter + 0.1 mm thick
Material: Amorphous Silicon | Thickness: 5 nm | Porosity: Nonporous | Window Size:(1) 25 µm
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(9 small windows) |
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Material: silicon nitride
Thickness: 5 nm
Two slot windows
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3.05mm diameter, see chart for thickness
Material: Copper (Cu), Copper-Rhodium (Cu-Rh), Nickel (Ni), Gold… Show more (+) 3.05mm diameter, see chart for thickness
Material: Copper (Cu), Copper-Rhodium (Cu-Rh), Nickel (Ni), Gold (Au), Molybdenum (Mo) Show less (-) |
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3.05mm diameter, see chart for thickness
Material: Copper (Cu), Copper-Rhodium (Cu-Rh), Nickel (Ni), Gold… Show more (+) 3.05mm diameter, see chart for thickness
Material: Copper (Cu), Copper-Rhodium (Cu-Rh), Nickel (Ni), Gold (Au), Molybdenum (Mo) Show less (-) |
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We have extended our range of TEM grid materials to include four types, which are… Show more (+) We have extended our range of TEM grid materials to include four types, which are now available in Molybdenum. The new products are manufactured using a process known as chemical “milling” (etching) instead of the more familiar technique of “electroforming” (deposition) that is used in the manufacture of copper, nickel and gold products. Molybdenum is […] Show less (-) |
