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Description
Epo-Tek® H20S is a modified version of Epo-Tek®H20E.
Epo-Tek® H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency (mixing ratio 1:1). This modified version offers high electrical conductivity, short curing cycles, proven reliability, and the convenient mix ratio, Epo-Tek® H20S is extremely simple to use. Epo-Tek® H20S pot life is 2.5 days and shelf life is one year when store at room temperature.
Maximum Bond Line Cure Schedule:
| 175°C | 45 seconds |
| 150°C | 5 minutes |
| 120°C | 15 minutes |
| 100°C | 45 minutes |
| 80°C | 90 minutes |
Typical properties: (to be used as a guide only, not a specification)
Physical Properties
| Color: | Part A: silver; Part B: silver |
| Consistency: | Smooth, thixotropic paste |
| Viscosity (@ 100 RPM / 23°C): | 1.800-2.800 cPs |
| Thixotropic Index: | 5 |
| Glass Transition Temp (Tg): | ≥80°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min) |
| Coefficient of Thermal Expansion (CTE): | Below Tg: 31 x 10-6 in/in/°C Above Tg: 120 x 10-6 in/in/°C |
| Shore D hardness: | 57 |
| Lap Shear Strength @ 23°C: | 1,240 psi |
| Die Shear Strength @ 23°C: | >5 kg / 1,700 psi |
| Degradation Temp (TGA): | 414°C |
| Weight Loss: | @ 200°C: 0.40% @ 300°C: 1.37% @ 250°C: 0.60% |
| Operating Temp: | Continuous: -55°C to 200°C Intermittent: -55°C to 300°C |
| Storage Modulus @ 23°C: | 339, 720 psi |
| Ion: | Cl- 162 ppm Na+ 0 ppm NH4+ 282ppm K+ 4 ppm |
| Particle Size: | ≤20 microns |
Electrical Properties:
| Volume Resistivity @ 23°C: | ≤0.0005 Ohm-cm |
Thermal Properties:
| Thermal Conductivity: | 3.25 W/mK |
Storage : RT
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