EPO-TEK® H20E – Epoxy conductive Adhesive

Unit : 1 oz

REF: D12671-20E Catégorie : ,


Epo-Tek® H20E is a two component,

100% solid silver-filled epoxy system, silver-resin paste and liquid hardener, mixing ration is 1:1.

– Epo-Tek H22E features high thermal conductivity, and is very well suited for extensive high temperature applications (300-400°C)
– Epo-Tek H20E is also a conductive adhesive of choice for old or new applications
– Its applications include: chip bonding and electronic bonding as well as SEM mounting
– H20E contains no solvents and will not outgas
– When cured, H20E isl resistant to solvents, resin and moisture
– Long Pot life (2½ days)
– Shelf life is one year when store at 23°C

Maximum Bond Line Cure Schedule:

175°C 45 seconds
150°C 5 minutes
120°C 15 minutes
80°C 3 hours

Typical properties: (to be used as a guide only, not a specification)

Physical Properties

Color: Part A: silver; Part B: silver
Consistency: Smooth, thixotropic paste
Viscosity (@ 100 RPM / 23°C): 2,200-3,200 cPs
Thixotropic Index: 3.69
Glass Transition Temp (Tg): ≥80°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min)
Coefficient of Thermal Expansion (CTE): Below Tg: 31 x 10-6 in/in/°C
Above Tg: 158 x 10-6 in/in/°C
Shore D hardness: 75
Lap Shear Strength @ 23°C: 1,475 psi
Die Shear Strength @ 23°C: >5 kg / 1,700 psi
Degradation Temp (TGA): 425°C
Weight Loss: @ 200°C: 0.59%
@ 300°C: 1.67%
@ 250°C: 1.09%
Operating Temp: Continuous: -55°C to 200°C
Intermittent: -55°C to 300°C
Storage Modulus @ 23°C: 808, 700 psi
Ion: Cl- 73 ppm
Na+ 2 ppm
NH4+ 98 ppm
K+ 3 ppm
Particle Size: ≤45 microns

Electrical Properties:

Volume Resistivity @ 23°C: ≤0.0004 Ohm-cm


Thermal Properties:

Thermal Conductivity: 2.50 W/mK
  29 W/mK, Based on Thermal Resistance Data: R = L x K-1 x A-1


Thermal Resistance:

(Junction to Case):

TO-18 package with nickel-gold metalized 20 x 20 mil chips and bonded with Epo-Tek H20E (2 mil thick)
Epo-Tek®H20E: 6.7 to 7.0°C/W
Solder: 4.0 to 5.0°C/W

Storage : RT

Technical Data Sheet





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