Description
Epo-Tek® H20E is a two component,
100% solid silver-filled epoxy system, silver-resin paste and liquid hardener, mixing ration is 1:1.
– Epo-Tek H22E features high thermal conductivity, and is very well suited for extensive high temperature applications (300-400°C)
– Epo-Tek H20E is also a conductive adhesive of choice for old or new applications
– Its applications include: chip bonding and electronic bonding as well as SEM mounting
– H20E contains no solvents and will not outgas
– When cured, H20E isl resistant to solvents, resin and moisture
– Long Pot life (2½ days)
– Shelf life is one year when store at 23°C
Maximum Bond Line Cure Schedule:
175°C | 45 seconds |
150°C | 5 minutes |
120°C | 15 minutes |
80°C | 3 hours |
Typical properties: (to be used as a guide only, not a specification)
Physical Properties
Color: | Part A: silver; Part B: silver |
Consistency: | Smooth, thixotropic paste |
Viscosity (@ 100 RPM / 23°C): | 2,200-3,200 cPs |
Thixotropic Index: | 3.69 |
Glass Transition Temp (Tg): | ≥80°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min) |
Coefficient of Thermal Expansion (CTE): | Below Tg: 31 x 10-6 in/in/°C Above Tg: 158 x 10-6 in/in/°C |
Shore D hardness: | 75 |
Lap Shear Strength @ 23°C: | 1,475 psi |
Die Shear Strength @ 23°C: | >5 kg / 1,700 psi |
Degradation Temp (TGA): | 425°C |
Weight Loss: | @ 200°C: 0.59% @ 300°C: 1.67% @ 250°C: 1.09% |
Operating Temp: | Continuous: -55°C to 200°C Intermittent: -55°C to 300°C |
Storage Modulus @ 23°C: | 808, 700 psi |
Ion: | Cl- 73 ppm Na+ 2 ppm NH4+ 98 ppm K+ 3 ppm |
Particle Size: | ≤45 microns |
Electrical Properties:
Volume Resistivity @ 23°C: | ≤0.0004 Ohm-cm |
Thermal Properties:
Thermal Conductivity: | 2.50 W/mK |
29 W/mK, Based on Thermal Resistance Data: R = L x K-1 x A-1 |
Thermal Resistance:
(Junction to Case): |
TO-18 package with nickel-gold metalized 20 x 20 mil chips and bonded with Epo-Tek H20E (2 mil thick) Epo-Tek®H20E: 6.7 to 7.0°C/W Solder: 4.0 to 5.0°C/W |
Storage : RT
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