EPO-TEK® H22 – Epoxy conductive Adhesive

Unit : 1 oz

REF: D12673-22 Categories: ,

Description

Epo-Tek® H22 is a two component,

silver-filled epoxy system. Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life 16 hours, and shelf life is 6 months at room temperature.

Maximum Bond Line Cure Schedule:

150°C 5 minutes
120°C 10 minutes
100°C 15 minutes
80°C 45 minutes

Epo-Tek® H22 features:
– Smooth, free-flowing, slightly thixotropic paste
– High Tg allows it to be used for high temperature applications (≤300°C)
– Contains no solvents – It is a NASA approved low outgasing époxy
– Excellent resistance to solvents, chemicals and moisture
– Extended pot life and fast curing at low temperature <100°C
– Designed for die bonding and sealing hybrid circuit. Recommended for SEM small angle cleavage and wafer bonding

Typical properties: (to be used as a guide only, not a specification)

Physical Properties

Color: Part A: silver; Part B: amber
Consistency: Smooth, flowing paste
Viscosity (@ 100 RPM / 23°C): 12,000-20,000 cPs
Thixotropic Index: 2.36
Glass Transition Temp (Tg): ≥100°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min)
Coefficient of Thermal Expansion (CTE): Below Tg: 39 x 10-6 in/in/°C
Above Tg: 224 x 10-6 in/in/°C
Shore D hardness: 80
Lap Shear Strength @ 23°C: 1,980 psi
Die Shear Strength @ 23°C: >5 kg / 1,700 psi
Degradation Temp (TGA): 454°C
Weight Loss: @ 200°C: 0.09%
@ 300°C: 1.42%
@ 250°C: 0.23%
Operating Temp: Continuous: -55°C to 250°C
Intermittent: -55°C to 350°C
Storage Modulus @ 23°C: 540, 120 psi
Ion: Cl- 175 ppm
Na+ 60 ppm
NH4+ 148 ppm
K+ 6 ppm
Particle Size: ≤45 microns

Electrical Properties:

Volume Resistivity @ 23°C: ≤0.0005 Ohm-cm

 

Thermal Properties:

Thermal Conductivity: 0.94 W/mK

 

Storage : RT

Technical Data Sheet

MSDS_12673-A

MSDS_12673-B

 

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