TEM Specimen Supports in Molybdenum – 200 mesh

3.05mm diameter, see chart for thickness
Material: Copper (Cu), Copper-Rhodium (Cu-Rh), Nickel (Ni), Gold (Au), Molybdenum (Mo)

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Description

We have extended our range of TEM grid materials to include four types, which are now available in Molybdenum. The new products are manufactured using a process known as chemical “milling” (etching) instead of the more familiar technique of “electroforming” (deposition) that is used in the manufacture of copper, nickel and gold products. Molybdenum is used principally in applications where it’s high temperature, hardness, expansion of coefficient and corrosion resistance characteristics are considered important. The material which is used has a purity of 99.9%.

Symbol: Mo
Atomic number: 42
Melting point: 2617.0°C (2890.15°K, 4742.6°F)
Boiling point: 4612.0°C (4885.15°K, 8333.6°F) –
Density: 10.22 g/cm3

 

DG200-Mo DG100-Mo DG2010-Mo DG1000-Mo
200 mesh 100 mesh 2×1 grid 1000 micron grid
Molybdenum MO TEM grids Molybdenum MO TEM grids square transmission Molybdenum MO TEM grids oval transmission Molybdenum MO TEM grids circle transmission
Overall Diameter 3.05mm 3.03mm 3.05mm 3.05mm
Rim Width 0.225mm 0.225mm N/A N/A
Rim Mark yes yes N/A N/A
Center Mark yes yes N/A N/A
Lines/inch 200 100 N/A N/A
Pitch 125µm 250µm N/A N/A
Bar Width 35µm 45µm N/A N/A
Hole Width 90µm 205µm 2x1mm 1000µm
Overall thickness 25µm 25µm 50µm 50µm
53.00 60.50 52.00 61.50
25/vial 25/vial 25/vial 25/vial

N’hésitez pas à nous contacter si vous souhaitez des informations supplémentaires ou un autre produit.

 

Informations complémentaires

Cat#

Cu, Ni, CP, Au, Mo

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